EP20K400FI784-2 vs EP20K400FI784-3 Comparaison
Comparaison détaillée côte à côte de EP20K400FI784-2 par Altera et EP20K400FI784-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400FI784-2 | EP20K400FI784-3 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $82,40 | $155,00 |
| Device Family | APEX 20K | — |
| Typical Gates | 400,000 | — |
| Logic Elements (LEs) | [DATA_NEEDED: logic elements count] | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | [DATA_NEEDED: ESB count] |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count] | — |
| Dedicated Inputs | 4 | 4 |
| Nominal Core Supply Voltage (VCCINT) | 2.5 V | — |
| VCCINT Range | 2.375 V to 2.625 V | — |
| Speed Grade | -2 | -3 (slowest) |
| Plage de température de fonctionnement | -40 °C to +100 °C | — |
| Package Type | S-PBGA-B784 (FineLine BGA) | — |
| Package Pin Count | 784 balls | — |
| Ball Pitch | 1.000 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 |
| Device Form Factor | Loadable PLD | — |
| Process Technology | [DATA_NEEDED: process node] | 0.18 µm CMOS SRAM |
| Configuration Memory | SRAM-based (volatile) | — |
| Family | — | APEX 20K |
| Typical Gate Count | — | 400,000 gates |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Température de fonctionnement | — | -40 °C to +100 °C (industrial) |
| Boîtier | — | 784-ball PBGA (Fine-pitch BGA) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.000 mm |
| Seated Height (max) | — | 2.7000 mm |
| Body Material | — | Plastic / Epoxy |
| Configuration Method | — | SRAM (external EPROM required) |