EP20K400FI784-2 vs EP20K400FI784-3 Comparação
Comparação detalhada lado a lado de EP20K400FI784-2 por Altera e EP20K400FI784-3 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP20K400FI784-2 | EP20K400FI784-3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $82,40 | $155,00 |
| Device Family | APEX 20K | — |
| Typical Gates | 400,000 | — |
| Logic Elements (LEs) | [DATA_NEEDED: logic elements count] | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | [DATA_NEEDED: ESB count] |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count] | — |
| Dedicated Inputs | 4 | 4 |
| Nominal Core Supply Voltage (VCCINT) | 2.5 V | — |
| VCCINT Range | 2.375 V to 2.625 V | — |
| Speed Grade | -2 | -3 (slowest) |
| Faixa de temperatura de operação | -40 °C to +100 °C | — |
| Package Type | S-PBGA-B784 (FineLine BGA) | — |
| Package Pin Count | 784 balls | — |
| Ball Pitch | 1.000 mm | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Nível MSL | [DATA_NEEDED: MSL rating] | 3 |
| Device Form Factor | Loadable PLD | — |
| Process Technology | [DATA_NEEDED: process node] | 0.18 µm CMOS SRAM |
| Configuration Memory | SRAM-based (volatile) | — |
| Family | — | APEX 20K |
| Typical Gate Count | — | 400,000 gates |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Temperatura de operação | — | -40 °C to +100 °C (industrial) |
| Encapsulamento | — | 784-ball PBGA (Fine-pitch BGA) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.000 mm |
| Seated Height (max) | — | 2.7000 mm |
| Body Material | — | Plastic / Epoxy |
| Configuration Method | — | SRAM (external EPROM required) |