EP20K600CF1020C7 vs EP20K600CEF672C7 Comparaison
Comparaison détaillée côte à côte de EP20K600CF1020C7 par Altera et EP20K600CEF672C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K600CF1020C7 | EP20K600CEF672C7 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $212,40 | $98,40 |
| Family | APEX 20KC | APEX 20KC (Enhanced Configuration) |
| Manufacturer | Altera (now Intel) | Intel (formerly Altera) |
| Typical Gates | 311,000 | — |
| Maximum System Gates | 600,000 | — |
| Logic Elements / Cells | 24,320 | 24,320 |
| Maximum Operating Frequency | 375.94 MHz | 375.94 MHz |
| Process Technology | 0.15 micrometer CMOS | 0.15 µm CMOS, all-layer copper |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (nominal 1.8 V) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| User I/O Count | 588 | — |
| Total Inputs | 580 + 4 dedicated | — |
| Propagation Delay (Tpd) | 1.6 ns | — |
| Boîtier | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) | 672-ball FineLine BGA (FC-FBGA) |
| Type de montage | Surface Mount (BGA) | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | — |
| Configuration Method | SRAM-based, serial/parallel passive or enhanced configuration device | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Series | — | APEX 20KC |
| Device Type | — | FPGA / Loadable PLD |
| Gate Count (typical) | — | 600,000 gates |
| Propagation Delay | — | 1.48 ns (typ) |
| User I/Os | — | 488 |
| Core Supply Voltage | — | 1.8 V |
| Package Code | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Température de fonctionnement | — | 0 °C to +85 °C (commercial) |
| Configuration | — | SRAM-based, serial or parallel (EPC) |
| Embedded Memory | — | EAB blocks (dual-port RAM with byte enables) |
| LVDS Support | — | True-LVDS channels integrated |
| MultiVolt I/O | — | 1.8 V, 2.5 V, 3.3 V interfaces |
| External Memory Interface | — | DDR SDRAM, QDR SRAM |
| JTAG Support | — | IEEE 1149.1 boundary-scan |