EP20K600CF672C8N vs EP20K600CF672C9N Comparaison
Comparaison détaillée côte à côte de EP20K600CF672C8N par Intel et EP20K600CF672C9N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K600CF672C8N | EP20K600CF672C9N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $108,00 | $175,00 |
| Device Type | SPLD | Loadable PLD / SRAM FPGA |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| Boîtier | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| Tension d'alimentation | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns (per logic element) |
| Fabrication Process | 0.15 µm | — |
| Température de fonctionnement | 0°C to 85°C | 0 C to 85 C (commercial) |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Type de montage | Surface mount | Surface Mount |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Résistance thermique | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| System Gates | — | 600,000 |
| Logic Elements | — | 24,320 |
| Maximum Operating Frequency | — | 250 MHz |
| Core Supply Voltage | — | 1.71 V to 1.89 V (1.8 V nominal) |
| User I/Os | — | 488 |
| Total Terminals | — | 672 |
| Package Type | — | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm |
| Process Technology | — | 0.15 µm all-layer copper |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive serial, active serial |
| Embedded Memory | — | MultiCore EABs supporting up to 311,000 RAM bits |