EP20K600CF672C8N vs EP20K600CF672C9N Comparison
Detailed side-by-side comparison of EP20K600CF672C8N by Intel and EP20K600CF672C9N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K600CF672C8N | EP20K600CF672C9N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $108.00 | $175.00 |
| Device Type | SPLD | Loadable PLD / SRAM FPGA |
| Product Type | FPGA / programmable logic device | β |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | β |
| Logic Elements or Cells | 24,320 | β |
| Macros | 2,432 | β |
| User I/O Count | 508 | β |
| Package Terminals | 652 pins | β |
| Package | BGA-652, 45 x 45 mm, 1.27 mm pitch | β |
| Package Description | 672-pin FC-FBGA | β |
| Supply Voltage | 1.8 V | β |
| Listed Frequency | 301.21 MHz | β |
| Propagation Delay | 1.48 ns | 1.48 ns (per logic element) |
| Fabrication Process | 0.15 Β΅m | β |
| Operating Temperature | 0Β°C to 85Β°C | 0 C to 85 C (commercial) |
| Interconnect Metal | All-layer copper metal | β |
| I/O Configuration | 508 user I/O | β |
| Mounting Type | Surface mount | Surface Mount |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | β |
| AEC-Q100 Qualification | unknown | β |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | β |
| Core Current | [DATA_NEEDED: core supply current] | β |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | β |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | β |
| Thermal Resistance | [DATA_NEEDED: junction-to-ambient thermal resistance] | β |
| System Gates | β | 600,000 |
| Logic Elements | β | 24,320 |
| Maximum Operating Frequency | β | 250 MHz |
| Core Supply Voltage | β | 1.71 V to 1.89 V (1.8 V nominal) |
| User I/Os | β | 488 |
| Total Terminals | β | 672 |
| Package Type | β | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm |
| Process Technology | β | 0.15 Β΅m all-layer copper |
| Configuration Interface | β | JTAG (IEEE 1149.1), passive serial, active serial |
| Embedded Memory | β | MultiCore EABs supporting up to 311,000 RAM bits |