EP20K600CF672I-8ES vs EP20K600CF672C8N Comparaison
Comparaison détaillée côte à côte de EP20K600CF672I-8ES par Altera et EP20K600CF672C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EP20K600CF672I-8ES - APEX 20KC 600K-Gate FPGA, 672-BGA | Intel / Altera
EP20K600CF672I-8ES Obsolete
Comparaison des spécifications
| Paramètre | EP20K600CF672I-8ES | EP20K600CF672C8N |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $119,00 | $108,00 |
| Family | APEX 20KC | APEX 20KC |
| Logic Elements | 24,320 | — |
| Typical Gates | 600,000 (ASIC-equivalent) | — |
| Embedded Memory Bits | 311,296 | — |
| Maximum User I/O Pins | 508 | — |
| Embedded PLLs | 4 | — |
| Core Voltage | 1.8 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, HSTL, GTL+ | — |
| Process Technology | 0.18 micron CMOS SRAM | — |
| Speed Grade | -8 (slower) | — |
| Température de fonctionnement | -40C to +100C (Industrial) | 0°C to 85°C |
| Boîtier | 672-ball BGA (FineLine BGA, 1.27 mm pitch) | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG | — |
| In-System Programmability | Yes (ISP via EPC16, EPC8, EPC4, EPC2, EPC1) | — |
| Statut RoHS | Non-compliant (legacy Altera leaded BGA process) | unknown |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Device Type | — | SPLD |
| Product Type | — | FPGA / programmable logic device |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Package Description | — | 672-pin FC-FBGA |
| Tension d'alimentation | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Propagation Delay | — | 1.48 ns |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| Type de montage | — | Surface mount |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |