EP20K600EFC144-2XN vs EP20K600CF672C8N Comparaison
Comparaison détaillée côte à côte de EP20K600EFC144-2XN par Altera et EP20K600CF672C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K600EFC144-2XN | EP20K600CF672C8N |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $115,00 | $108,00 |
| Family | APEX 20KE | APEX 20KC |
| Logic Elements | 24,576 | — |
| Typical Gates | 600,000 | — |
| Maximum System Gates | 1,053,840 | — |
| Embedded RAM Bits | 311,040 bits (~38 KB) | — |
| Number of ESBs (Embedded System Blocks) | [DATA_NEEDED: ESB count] | — |
| Number of Multiplier Blocks | [DATA_NEEDED: multiplier count] | — |
| Number of PLLs | 4 | — |
| Number of I/O Pins | [DATA_NEEDED: usable I/O count] | — |
| Core Voltage | 1.8 V | — |
| I/O Voltage Banks | Multi-voltage (LVTTL/LVCMOS/PCI) | — |
| Process Technology | 0.18 um CMOS, 6-layer metal | — |
| Speed Grade | -2 (mid-tier) | — |
| Boîtier | 144-ball FineLine BGA | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Température de fonctionnement | -40C to +85C (industrial, 'N' suffix) | 0°C to 85°C |
| Statut RoHS | [DATA_NEEDED: RoHS] | unknown |
| Configuration Method | SRAM, IEEE 1532 / passive serial / passive parallel | [DATA_NEEDED: configuration memory and programming method] |
| Device Type | — | SPLD |
| Product Type | — | FPGA / programmable logic device |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Package Description | — | 672-pin FC-FBGA |
| Tension d'alimentation | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Propagation Delay | — | 1.48 ns |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| Type de montage | — | Surface mount |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |