EP2A40B724C7 vs EP2A40B724C9 Comparaison
Comparaison détaillée côte à côte de EP2A40B724C7 par Intel et EP2A40B724C9 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40B724C7 | EP2A40B724C9 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $650,00 | $395,38 |
| Family | APEX II | — |
| Logic Elements / Cells | 38,400 | — |
| Total System Gates | 1,500,000 | — |
| Embedded RAM Bits | 655,360 | 655,360 (approximately 655 Kbits / 80 Kbytes) |
| Maximum User I/O | 540 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (typ. 1.5 V) | — |
| Process Technology | 0.15 µm CMOS, up to 8 metal layers, all-layer copper | — |
| Maximum Internal Frequency | 562 MHz | — |
| PLLs | 4 | — |
| Boîtier | 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm | — |
| Température de fonctionnement | 0 °C to +85 °C (commercial) | 0C to +85C |
| I/O Standards Supported | LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) | — |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices | — |
| MultiVolt I/O Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| DDR Memory Support | Yes (via ESB / I/O circuitry) | — |
| Statut RoHS | Non-compliant (lead-bearing FCBGA) | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Series | — | APEX II |
| Logic Elements (LE) | — | 38,400 |
| Number of User I/O | — | 540 |
| Tension d'alimentation de fonctionnement | — | 1.425 V to 1.575 V (core) |
| Boîtier / Format | — | 724-BBGA, FCBGA (Flip-Chip BGA) |
| Supplier Device Package | — | 724-BGA (35x35 mm) |
| Shipping Medium | — | Tray |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Architecture | — | LUT-based with embedded memory blocks |
| Typical Core Power | — | [DATA_NEEDED: ICCDAT typical] |