EP2A40F1020C6 vs EP2A40F1020C8N Comparaison
Comparaison détaillée côte à côte de EP2A40F1020C6 par Intel et EP2A40F1020C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F1020C6 | EP2A40F1020C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $149,00 | $0,00 |
| Family | APEX II | — |
| Maximum System Gates | 1,600,000 | — |
| Typical Gates | 40,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Embedded System Bits | 655,360 bits | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Number of PLLs | 4 | — |
| Core Supply Voltage | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Boîtier | FBGA-1020 | — |
| Process Technology | 0.15 µm CMOS | — |
| Configuration Interface | Passive Serial, Passive Parallel, Passive Asynchronous, JTAG (IEEE 1149.1) | — |
| In-System Programmability | Yes | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Température de fonctionnement | — | 0 °C to 85 °C |
| Type de montage | — | Surface Mount |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |