EP2A40F1020C6 vs EP2A40F1020C8N Comparação
Comparação detalhada lado a lado de EP2A40F1020C6 por Intel e EP2A40F1020C8N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2A40F1020C6 | EP2A40F1020C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $149,00 | $0,00 |
| Family | APEX II | — |
| Maximum System Gates | 1,600,000 | — |
| Typical Gates | 40,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Embedded System Bits | 655,360 bits | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Number of PLLs | 4 | — |
| Core Supply Voltage | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Encapsulamento | FBGA-1020 | — |
| Process Technology | 0.15 µm CMOS | — |
| Configuration Interface | Passive Serial, Passive Parallel, Passive Asynchronous, JTAG (IEEE 1149.1) | — |
| In-System Programmability | Yes | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Temperatura de operação | — | 0 °C to 85 °C |
| Tipo de montagem | — | Surface Mount |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |