EP2A40F1020C9N vs EP2A40F1020C8N Comparaison
Comparaison détaillée côte à côte de EP2A40F1020C9N par Intel et EP2A40F1020C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F1020C9N | EP2A40F1020C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $175,00 | $0,00 |
| Family | APEX II | — |
| Series | EP2A40 | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Family | CMOS | — |
| System Gates | 1.5 M | — |
| Logic Cells / Elements | 38,400 | — |
| Maximum Operating Frequency | 366 MHz | — |
| Propagation Delay | 1.55 ns | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | — |
| User I/O Pins | 735 | — |
| Total Pins | 1020 | — |
| Boîtier | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch, FineLine | — |
| Température de fonctionnement | 0 °C to 85 °C | 0 °C to 85 °C |
| I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, GTL+, SSTL | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| On-chip Memory | Embedded System Blocks (ESB) for RAM/ROM | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | unknown | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |