EP2A40F1020I8N vs EP2A40F1020C8N Comparaison
Comparaison détaillée côte à côte de EP2A40F1020I8N par Intel et EP2A40F1020C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F1020I8N | EP2A40F1020C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $125,40 | $0,00 |
| Family | APEX II (EP2A40) | — |
| Logic Elements | 38,400 cells | — |
| System Gates | 1.5 M (typical) | — |
| Process Technology | 0.15 um CMOS | — |
| Core Voltage | 1.5 V | — |
| Maximum Internal Frequency | 376 MHz | — |
| User I/O Count | 735 (maximum) | — |
| Boîtier | 1020-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Operating Temperature Grade | Industrial (-40 C to +100 C) / 'I' suffix | — |
| Speed Grade | 8 | — |
| Architecture | LUT-based with embedded system blocks (ESBs) | — |
| Configuration | SRAM-based, JTAG / passive serial / passive parallel | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Total Embedded Memory | [DATA_NEEDED: embedded memory bits] | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Température de fonctionnement | — | 0 °C to 85 °C |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |