EP2A40F33C-9 vs EP2A40F33C-8 Comparaison
Comparaison détaillée côte à côte de EP2A40F33C-9 par Intel et EP2A40F33C-8 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F33C-9 | EP2A40F33C-8 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $78,00 | $0,00 |
| Family | APEX II | APEX II |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | [DATA_NEEDED: embedded RAM bits] |
| Boîtier | 672-ball FineLine BGA (F33), 1.27 mm pitch | FBGA-672 (F33) |
| Speed Grade | -9 | -8 (slowest tier) |
| Température de fonctionnement | 0C to +85C (commercial) | 0C to +85C (Commercial, 'C' suffix) |
| Process Technology | 0.15 micrometer CMOS | — |
| PLLs | 4 | — |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 40,000 |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | — |
| Niveau MSL | 3 | — |
| Peak Reflow Temperature | 220 C | 220 C |
| Statut RoHS | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS compliance status] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Maximum Gates | — | [DATA_NEEDED: maximum gate count] |
| Nombre de broches | — | 672 |
| Substrate Size | — | 33 mm |
| Niveau de sensibilité à l'humidité (MSL) | — | 3 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Family Prefix | — | EP2A (APEX II series) |
| Device Class | — | FPGA / Programmable Logic Device |