EP2A40F672C6N vs EP2A40F672C8 Comparaison
Comparaison détaillée côte à côte de EP2A40F672C6N par Intel et EP2A40F672C8 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F672C6N | EP2A40F672C8 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $165,00 | $68,00 |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | — |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Boîtier | 672-ball FineLine BGA | — |
| Température de fonctionnement | Commercial (0C to +85C) | 0 C to 85 C (commercial) |
| Speed Grade | C6 (per part number suffix) | — |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15-micron all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Logic Family | — | CMOS |
| Typical Logic Elements (LEs) | — | 40,000 |
| Embedded Memory | — | Up to 1.5 Mbits |
| User I/Os | — | 492 pins |
| Nombre de broches | — | 672 |
| Package Type | — | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Propagation Delay (speed grade C8) | — | 1.55 ns |
| Phase-Locked Loops (PLLs) | — | 4 |
| LVDS Signaling Support | — | Up to 1 Gbps |
| Multipliers | — | Embedded multiplier blocks |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |