EP2A40F672C6N vs EP2A40F672C8 Comparación
Comparación detallada lado a lado de EP2A40F672C6N por Intel y EP2A40F672C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C6N | EP2A40F672C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $68,00 |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | — |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Encapsulado | 672-ball FineLine BGA | — |
| Temperatura de funcionamiento | Commercial (0C to +85C) | 0 C to 85 C (commercial) |
| Speed Grade | C6 (per part number suffix) | — |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15-micron all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Logic Family | — | CMOS |
| Typical Logic Elements (LEs) | — | 40,000 |
| Embedded Memory | — | Up to 1.5 Mbits |
| User I/Os | — | 492 pins |
| Número de pines | — | 672 |
| Package Type | — | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Propagation Delay (speed grade C8) | — | 1.55 ns |
| Phase-Locked Loops (PLLs) | — | 4 |
| LVDS Signaling Support | — | Up to 1 Gbps |
| Multipliers | — | Embedded multiplier blocks |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |