EP2A40F672C8 vs EP2A40F672C6N Comparaison
Comparaison détaillée côte à côte de EP2A40F672C8 par Intel et EP2A40F672C6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F672C8 | EP2A40F672C6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $68,00 | $165,00 |
| Family | APEX II | APEX II |
| Logic Family | CMOS | — |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | — |
| User I/Os | 492 pins | — |
| Nombre de broches | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | SRAM-based, 0.18 um (per family datasheet) |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Température de fonctionnement | 0 C to 85 C (commercial) | Commercial (0C to +85C) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 40,000 |
| Maximum System Gates | — | 1,125,000 |
| Embedded RAM Bits | — | 442,368 |
| Embedded System Blocks (ESBs) | — | 160 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O count] |
| Core Voltage | — | 1.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V |
| Boîtier | — | 672-ball FineLine BGA |
| Speed Grade | — | C6 (per part number suffix) |
| Configuration Methods | — | Passive Serial, Passive Parallel, JTAG |
| Statut RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| PLL Count | — | [DATA_NEEDED: PLL count] |