EP2AGX45DF29I3N vs EP2AGX45DF29C6G Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29I3N par Intel et EP2AGX45DF29C6G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29I3N | EP2AGX45DF29C6G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $215,00 | $121,75 |
| Family | Arria II GX | Intel FPGA (formerly Altera) |
| Series | EP2AGX45 | Arria II GX |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| Température de fonctionnement | -40 C to +100 C (industrial) | 0C to +85C (commercial) |
| Speed Grade | I3 | C6 (commercial, mid-speed) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| Boîtier | 780-ball FC-FBGA (DF29) | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| Statut RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 45,000 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| DSP 18x18 Multipliers | — | 312 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Process Node | — | 40 nm TSMC low-power |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | — | SRAM-based, volatile |
| Niveau MSL | — | 3 (168 hours) |