EP2AGX45DF29I3N vs EP2AGX45DF29C6G 对比
详细并排对比 EP2AGX45DF29I3N 出自 Intel 和 EP2AGX45DF29C6G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX45DF29I3N | EP2AGX45DF29C6G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $215.00 | $121.75 |
| Family | Arria II GX | Intel FPGA (formerly Altera) |
| Series | EP2AGX45 | Arria II GX |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| 工作温度 | -40 C to +100 C (industrial) | 0C to +85C (commercial) |
| Speed Grade | I3 | C6 (commercial, mid-speed) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| 封装 | 780-ball FC-FBGA (DF29) | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements (LE) | — | 45,000 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| DSP 18x18 Multipliers | — | 312 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Process Node | — | 40 nm TSMC low-power |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | — | SRAM-based, volatile |
| MSL 等级 | — | 3 (168 hours) |