EP2AGX45DF29I6N vs EP2AGX45DF29I3N Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29I6N par Intel et EP2AGX45DF29I3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29I6N | EP2AGX45DF29I3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $185,00 | $215,00 |
| Device Family | Arria II GX | — |
| Device Sub-family | EP2AGX45 | — |
| Logic Elements | 42,960 | — |
| Embedded Memory | 1,728 Kbits (M9K + M144K) | — |
| User I/O Pins | 364 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | — |
| Hard PCIe IP | PCIe Gen1/Gen2 x1/x4 endpoints | — |
| Hard Memory Controller | DDR3 (with soft PHY) | — |
| Boîtier | 780-ball FCBGA (FineLine BGA, DF29 pin-out) | 780-ball FC-FBGA (DF29) |
| Speed Grade | 6 (fastest transceiver bin) | I3 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Process Node | 40 nm TSMC | — |
| Logic Element Structure | 8-input ALM (Adaptive Logic Module) | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Family | — | Arria II GX |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Température de fonctionnement | — | -40 C to +100 C (industrial) |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |