EP2AGZ300FH29C4N vs EP2AGZ300FF35C4N Comparaison
Comparaison détaillée côte à côte de EP2AGZ300FH29C4N par Intel et EP2AGZ300FF35C4N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGZ300FH29C4N | EP2AGZ300FF35C4N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 395,00 | $1 350,00 |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Adaptive Logic Modules (ALMs) | 119,200 | — |
| Embedded Memory (bits) | 18,854,912 | 18,854,912 (~17.9 Mbit) |
| User I/O Pins | 281 | — |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | [DATA_NEEDED: number of DSP blocks] |
| Transceivers | Up to 28 (up to 6.375 Gbps) | Multi-gigabit transceivers integrated |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Boîtier | 780-ball FC-HFBGA (FH29) | — |
| Speed Grade | C4 | — |
| Temperature Grade | Industrial (N suffix) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | Compliant | Compliant (per Besenchips / DigiKey listing) |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |