EP2AGZ300FH29C4N vs EP2AGZ300FF35C4N Comparação
Comparação detalhada lado a lado de EP2AGZ300FH29C4N por Intel e EP2AGZ300FF35C4N por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2AGZ300FH29C4N | EP2AGZ300FF35C4N |
|---|---|---|
| Marca | Intel | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.395,00 | $1.350,00 |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Adaptive Logic Modules (ALMs) | 119,200 | — |
| Embedded Memory (bits) | 18,854,912 | 18,854,912 (~17.9 Mbit) |
| User I/O Pins | 281 | — |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | [DATA_NEEDED: number of DSP blocks] |
| Transceivers | Up to 28 (up to 6.375 Gbps) | Multi-gigabit transceivers integrated |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Encapsulamento | 780-ball FC-HFBGA (FH29) | — |
| Speed Grade | C4 | — |
| Temperature Grade | Industrial (N suffix) | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant (per Besenchips / DigiKey listing) |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |