EP2C8F256I8N vs EP2C8F256C6 Comparaison
Comparaison détaillée côte à côte de EP2C8F256I8N par Intel et EP2C8F256C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2C8F256I8N | EP2C8F256C6 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $21,95 | $8,10 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | 516 |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | — |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Température de fonctionnement | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Statut RoHS | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: rohs status] |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Number of I/O | — | 182 |
| Number of Logic Elements/Cells | — | 8256 |
| Embedded Multipliers | — | 36 (18x18) |
| Boîtier | — | 256-LBGA (FBGA) |
| Package Pin/Pin Count | — | 256 |
| Process Node | — | 90 nm |
| Tension d'alimentation | — | 1.15 V to 3.3 V (bank-dependent) |
| Configuration Mode | — | AS / PS / JTAG |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |