EP2C8F256I8N vs EP2C8F256C6 对比
详细并排对比 EP2C8F256I8N 出自 Intel 和 EP2C8F256C6 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2C8F256I8N | EP2C8F256C6 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $21.95 | $8.10 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | 516 |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | — |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| 工作温度 | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| RoHS 状态 | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: rohs status] |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Number of I/O | — | 182 |
| Number of Logic Elements/Cells | — | 8256 |
| Embedded Multipliers | — | 36 (18x18) |
| 封装 | — | 256-LBGA (FBGA) |
| Package Pin/Pin Count | — | 256 |
| Process Node | — | 90 nm |
| 电源电压 | — | 1.15 V to 3.3 V (bank-dependent) |
| Configuration Mode | — | AS / PS / JTAG |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |