EP2SGX60EF1152I5N vs EP2SGX60EF1152C5N Comparaison
Comparaison détaillée côte à côte de EP2SGX60EF1152I5N par Intel et EP2SGX60EF1152C5N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX60EF1152I5N | EP2SGX60EF1152C5N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $3 300,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 60,440 | — |
| Logic Blocks | 60,440 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Internal Frequency | 717 MHz | — |
| Reported Internal Frequency | 609.76 MHz | — |
| Fréquence d'horloge maximale | 622.08 MHz | — |
| Plage de température de fonctionnement | -40 °C to 85 °C | — |
| Boîtier | 1152-ball BGA | 1152-ball FC-FBGA |
| Package Type | FC-FBGA | — |
| Package Dimensions | 23 x 23 mm | — |
| Terminal Pitch | 1 mm | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and size] | — |
| I/O Count | [DATA_NEEDED: user I/O count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Speed Grade | — | -5 (mid) |
| Température de fonctionnement | — | Commercial (0C to +85C) |
| Type de montage | — | Surface Mount (Flip-Chip BGA) |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |