EP2SGX60EF1152I5N vs EP2SGX60EF1162I4N Comparaison
Comparaison détaillée côte à côte de EP2SGX60EF1152I5N par Intel et EP2SGX60EF1162I4N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX60EF1152I5N | EP2SGX60EF1162I4N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $392,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 60,440 | — |
| Logic Blocks | 60,440 | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Internal Frequency | 717 MHz | — |
| Reported Internal Frequency | 609.76 MHz | — |
| Fréquence d'horloge maximale | 622.08 MHz | — |
| Plage de température de fonctionnement | -40 °C to 85 °C | — |
| Boîtier | 1152-ball BGA | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch |
| Package Type | FC-FBGA | — |
| Package Dimensions | 23 x 23 mm | — |
| Terminal Pitch | 1 mm | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and size] | — |
| I/O Count | [DATA_NEEDED: user I/O count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Statut RoHS | unknown | Compliant |
| REACH Status | unknown | — |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| Embedded Memory | — | 2,544,192 bits |
| DSP Blocks | — | 12 |
| 18x18 Multipliers | — | 252 |
| User I/Os | — | 534 |
| Transceivers | — | Up to 20 (600 Mbps to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Speed Grade | — | I4 (industrial) |
| Temperature Range | — | -40C to +100C (junction) |
| Core Voltage | — | 1.2 V |
| Configuration Mode | — | Enhanced (EPC) / Fast Passive Parallel (FPP) |
| Type de montage | — | Surface Mount (BGA) |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 90 nm |