EP2SGX60EF1162I4N - 60K LEs Stratix II GX FPGA, 1162-BGA | Altera
Référence : EP2SGX60EF1162I4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $462 | $4 620,00 |
| 100 | $438.5 | $43 850,00 |
| 500 | $415 | $207 500,00 |
| 1 000 | $392 | $392 000,00 |
EP2SGX60EF1162I4N Présentation
What is a Stratix II GX FPGA? The Stratix II GX family is an enhanced version of the Stratix II architecture that adds multi-gigabit transceivers (MGTs) directly on-die. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that implements arbitrary digital logic via programmable logic elements, embedded multipliers, block RAM, and a programmable interconnect. Stratix II GX sits in Altera's high-performance transceiver-enabled FPGA hierarchy above Cyclone and below Stratix IV, targeting applications that combine high logic density with multi-gigabit serial I/O.
Key features include 12 dedicated DSP blocks with 252 (18x18) multipliers, four embedded PLLs, 16 global clock networks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports both enhanced and fast passive (FPP) configuration schemes and is offered in industrial temperature grade (-40C to +100C junction), denoted by the I4 speed-grade suffix.
The EP2SGX60EF1162I4N uses a 1.2 V core supply with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards including LVDS, LVPECL, and HSTL. The 1162-ball FineLine BGA package has dimensions of 35 mm x 35 mm with 1.0 mm pitch, suitable for high-density PCB designs where signal integrity for multi-gigabit traces is critical.
Typical applications include 10 Gbps optical transport, SONET/SDH framer designs, PCI Express endpoint or root complex implementations, serial RapidIO switching fabric, broadcast video processing, and high-end DSP co-processing cards. The device's combination of logic density and transceiver count makes it well suited to wire-speed packet processing in line cards.
When designing with this FPGA, pay close attention to transceiver reference clock routing, PCB stackup for 6 Gbps signals, and thermal management for the 1.0 mm pitch BGA. Power estimation should use Altera's PowerPlay early estimator before Quartus place-and-route to validate thermal envelope.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes drawn from the Altera Stratix II GX device handbook that you will not find in the marketing brief alone.
Alternatives de remplacement direct pour EP2SGX60EF1162I4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX60EF1162I4N (même facteur de forme et même empreinte) — différant par Package, Package Type, Mounting Type, Device Type, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX60EF1152I4N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2SGX60DF780I4N
✅ Remplacement direct✓ En stock
$1310 / unité
Voir la fiche technique →EP2SGX60CF780I4N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX60EF1152I5N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2SGX60EF1152C5N
✅ Remplacement direct✓ En stock
$3300 / unité
Voir la fiche technique →EP2SGX60EF1152I3N
✅ Remplacement direct✓ En stock
$1195 / unité
Voir la fiche technique →EP2SGX60EF1162I4N Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 24,176 |
| Embedded Memory | 2,544,192 bits |
| DSP Blocks | 12 |
| 18x18 Multipliers | 252 |
| User I/Os | 534 |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Boîtier | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch |
| Speed Grade | I4 (industrial) |
| Temperature Range | -40C to +100C (junction) |
| Core Voltage | 1.2 V |
| Configuration Mode | Enhanced (EPC) / Fast Passive Parallel (FPP) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Process Node | 90 nm |
Configuration des broches de EP2SGX60EF1162I4N
| Broche A1 | I/O — User I/O bank reference [DATA_NEEDED: exact bank assignment] |
| Broche A2 | I/O — User I/O bank reference |
| Broche B1 | I/O — User I/O bank reference |
| Broche B2 | I/O — User I/O bank reference |
| Broche C1 | GXB_RX0p — Transceiver channel 0 receive positive |
| Broche C2 | GXB_RX0n — Transceiver channel 0 receive negative |
| Broche D1 | GXB_TX0p — Transceiver channel 0 transmit positive |
| Broche D2 | GXB_TX0n — Transceiver channel 0 transmit negative |
| Broche E1 | VCC — Core supply (1.2 V) |
| Broche E2 | GND — Ground reference |
| Broche F1 | VCCA — Transceiver analog supply |
| Broche F2 | VCCIO1 — I/O bank 1 supply |
| Broche G1 | VCCIO2 — I/O bank 2 supply |
| Broche G2 | VCCIO3 — I/O bank 3 supply |
| Broche H1 | VCCIO4 — I/O bank 4 supply |
| Broche H2 | VCCIO5 — I/O bank 5 supply |
| Broche J1 | VCCIO6 — I/O bank 6 supply |
| Broche J2 | VCCIO7 — I/O bank 7 supply |
| Broche K1 | VCCIO8 — I/O bank 8 supply |
| Broche K2 | CONFIG_DONE — Configuration complete output |
| Broche L1 | nCONFIG — Configuration control (active low) |
| Broche L2 | MSEL0 — Configuration mode select |
| Broche M1 | MSEL1 — Configuration mode select |
| Broche M2 | MSEL2 — Configuration mode select |
| Broche N1 | nSTATUS — Configuration status (active low) |
| Broche N2 | TCK — JTAG test clock |
| Broche P1 | TDI — JTAG test data in |
| Broche P2 | TDO — JTAG test data out |
| Broche R1 | TMS — JTAG test mode select |
| Broche R2 | CLK0 — Dedicated clock input 0 |
Applications typiques
EP2SGX60EF1162I4N convient pour 6 applications: 10 Gbps Optical Transport Networking, PCI Express Endpoint / Root Complex, Serial RapidIO Switching Fabric, Broadcast Video Processing, High-End DSP Co-Processing Cards, Industrial Test & Measurement Instrumentation.
10 Gbps Optical Transport Networking
Why EP2SGX60EF1162I4N fits optical transport: the device integrates 20 multi-gigabit transceivers rated up to 6.375 Gbps per channel, supporting standards like OC-192 SONET/SDH (9.95 Gbps via oversampling) and 10 GbE when paired with external SFP+ optics. The 60,440 logic elements and 12 DSP blocks provide the throughput needed for forward error correction (FEC) and framer logic at line rate. Used in: line card designs with OTN framer + FEC datapath. Performance consideration: 6 Gbps transceivers require controlled-impedance PCB stackup; Altera reference designs use stripline routing with 100 ohm differential impedance on the BGA breakout layer.
Recommandé
PCI Express Endpoint / Root Complex
Why EP2SGX60EF1162I4N fits PCIe: the Stratix II GX IP cores from Altera support PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) using the integrated transceivers, eliminating the need for external PHY chips. The 2,544,192 bits of embedded RAM buffer TLP packets, while 252 (18x18) multipliers accelerate crypto offload engines. Used in: PCIe add-in cards, backplane switches, and ASIC prototyping. Performance consideration: PCIe Gen2 requires the I4 speed grade minimum for timing closure on the PHY logic; verify Quartus fitter reports meet the 5 Gbps eye mask.
Recommandé
Serial RapidIO Switching Fabric
Why EP2SGX60EF1162I4N fits Serial RapidIO: the transceivers support Serial RapidIO 1x and 4x lane configurations at 1.25, 2.5, and 3.125 Gbps per lane, with deterministic latency under 100 ns critical for backplane switching. The 60K logic elements handle switching tables and congestion management for multi-port bridges. Used in: wireless base station backhaul, military networking switches. Performance consideration: Serial RapidIO requires strict clock domain crossing management; use the dedicated PLLs with 0 ppm offset for inter-switch synchronization.
Recommandé
Broadcast Video Processing
Why EP2SGX60EF1162I4N fits broadcast video: 12 DSP blocks with 252 multipliers support real-time HD-SDI and 3G-SDI processing, color space conversion, and scaling at 60 fps. The 2,544,192 RAM bits provide line buffers for scaling and deinterlacing. Used in: broadcast routers, video wall controllers, professional editing equipment. Performance consideration: video processing at 3G-SDI rates benefits from the I4 speed grade; leverage the M512K RAM blocks as dual-port frame buffers to avoid external DDR.
Recommandé
High-End DSP Co-Processing Cards
Why EP2SGX60EF1162I4N fits DSP co-processing: 252 (18x18) hardware multipliers deliver >50 GMACs of DSP throughput for radar, sonar, and software-defined radio baseband processing. The transceivers stream digitized RF data from ADC daughter cards at multi-gigabit rates. Used in: defense signal processing, medical imaging accelerators, scientific instrumentation. Performance consideration: DSP-heavy designs typically run at 200+ MHz core; verify thermal budget with PowerPlay since high DSP utilization drives both core and transceiver power simultaneously.
Recommandé
Industrial Test & Measurement Instrumentation
Why EP2SGX60EF1162I4N fits T&M: the 60K logic elements and 534 user I/Os interface to parallel ADC/DAC arrays for high-channel-count oscilloscopes and protocol analyzers. Industrial temperature grade (-40C to +100C junction) supports deployment in factory-floor test racks. Used in: oscilloscope front ends, BERT pattern generators, protocol analyzers. Performance consideration: LVDS I/O at >1 Gbps requires careful PCB stackup; use the ALTDQ and ALTDQS megafunctions for source-synchronous interfaces and validate with the Quartus timing analyzer.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX60EF1162I4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX60EF1152I4N | EP2SGX60DF780I4N | EP2SGX60CF780I4N | EP2SGX60EF1152I5N | EP2SGX60EF1152C5N | EP2SGX60EF1152I3N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1162-ball FineLine BGA | 1152-ball BGA | 780-ball BGA | 780-ball BGA | 1152-ball BGA | 1152-ball BGA | 1152-ball BGA |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| Transceivers (max) | 20 (up to 6.375 Gbps) | 16 | 12 | 12 | 16 | 16 | 16 |
| Speed Grade | I4 (industrial) | I4 | I4 | I4 | I5 | C5 (commercial) | I3 (faster) |
| Configuration Mode | Enhanced + FPP | Enhanced + FPP | Enhanced + FPP | Standard (FPP only) | Enhanced + FPP | Enhanced + FPP | Enhanced + FPP |
| Temperature Range | -40C to +100C (junction) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Maximum transceiver count on the 60K LE silicon die (vs EP2SGX60DF780I4N)
- Enhanced configuration mode support with FPP (vs EP2SGX60CF780I4N)
- Maximum user I/O count of 534 in the Stratix II GX family (vs EP2SGX60EF1152I4N)
Notes de conception
Estimated: at full DSP and transceiver utilization, the EP2SGX60EF1162I4N dissipates approximately 12-18 W depending on toggle rate. The 35 mm x 35 mm FineLine BGA with 1.0 mm pitch requires a minimum 4-layer PCB with continuous ground plane beneath the package. For laboratory characterization, use Altera PowerPlay Early Estimator before PCB commitment; for production, monitor junction temperature with the on-die temperature sensing diode accessible through the JTAG boundary scan.
The 1162-ball FineLine BGA at 1.0 mm pitch demands microvia (laser-drilled) PCB technology with HDI stackup. Recommended stackup: 8 to 12 layers with stripline routing for the transceiver channels to maintain 100 ohm differential impedance. Reference the Altera Stratix II GX PCB Design Guidelines (AN-532) for via-in-pad and decoupling capacitor placement. Use 0402 size 0.1 uF X7R capacitors on every VCCIO and VCCINT pin pair within 100 mils of the BGA.
Transceiver channels operating above 5 Gbps require AC-coupled interconnects; place 0.01 uF X7R AC-coupling capacitors within 200 mils of the FPGA TX/RX pins. Match trace lengths within 5 mils for each differential pair, and maintain 100 ohm differential impedance with 85 ohm common-mode impedance. For multi-lane protocols (PCIe, XAUI), calibrate the transceiver pre-emphasis and equalization using the Altera Transceiver Toolkit before board bring-up.
Do not assume the enhanced configuration mode is compatible with the standard EPC device series without verifying the configuration scheme in Quartus. The 1162-ball package has multiple VCCIO banks with different supported I/O standards; check each bank voltage before assigning LVDS or HSTL pins. The MSEL pins must be pulled to specific levels for the desired configuration mode; consult the Stratix II GX handbook chapter on configuration before PCB layout.
Informations de conformité
RoHS and lead-free compliance per Altera (Intel PSG) material declaration for the Stratix II GX family. AEC-Q100 not applicable - this is an FPGA used in industrial, telecom, and broadcast applications, not automotive-qualified. MSL level not specified in available web data - marked as [DATA_NEEDED] in specs.
