EP3C25F256C8 vs EP3C25F256I7N Comparaison
Comparaison détaillée côte à côte de EP3C25F256C8 par Intel et EP3C25F256I7N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C25F256C8 | EP3C25F256I7N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | Cyclone III FPGA | FPGA |
| Logic Cells | 24,624 cells | — |
| Maximum Frequency | 402 MHz | — |
| Fabrication Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Embedded Memory | 608,256 bits | 608,256 bits |
| User I/O Count | 156 I/Os | — |
| Logic Blocks | 1,539 LABs | — |
| Package Type | 256-pin FBGA | — |
| Package Pin Count | 256 pins | — |
| Package Standard | MS-034 FBGA-256 | — |
| Type de montage | Surface mount | Surface Mount |
| Température de fonctionnement | -40 °C to +125 °C | -40C to +125C |
| Lead-Free Status | Lead-free package | — |
| Programmable Logic Type | SRAM-configured FPGA | — |
| FPGA Family | Cyclone III | — |
| Product Category | Field programmable gate arrays | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free) |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| Configuration Method | [DATA_NEEDED: supported configuration methods] | — |
| Differential I/O Standards | [DATA_NEEDED: supported differential I/O standards] | — |
| Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Boîtier | — | 256-FBGA (FineLine BGA) |
| Speed Grade | — | 7 |
| Process Technology | — | 65 nm low-power |
| PLLs | — | 4 general-purpose PLLs |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |