EP3CLS70F780I7 vs EP3CLS100F780I7 Comparaison
Comparaison détaillée côte à côte de EP3CLS70F780I7 par Intel et EP3CLS100F780I7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3CLS70F780I7 | EP3CLS100F780I7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $125,00 | $775,00 |
| Family | Cyclone III LS | — |
| Logic Elements (LEs) | 70,208 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) | 4,451,328 bits (~4.4 Mbit) |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 413 | — |
| PLLs | 4 | Up to 8 (family maximum) |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 429 | — |
| Boîtier | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) | 780-ball FBGA (F780) |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Bitstream Encryption | AES-128/256 (LS-family feature) | — |
| Process Node | 60 nm TSMC low-power | — |
| Statut RoHS | Non-compliant (per Cyclone III LS datasheet prefix per verified data) | Compliant |
| Speed Grade | 7 (moderate) | — |
| Device Family | — | Cyclone III LS |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 100,448 |
| Number of Logic Array Blocks | — | 47 (per distributor summary) |
| Number of Transceivers | — | 4 |
| Maximum User I/O | — | 413 |
| Supply Voltage (Core) | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Method | — | SRAM-based, JTAG or external flash (EPCS/EPCQ) |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Security Features | — | 256-bit AES bitstream encryption, JTAG disable |
| Type de montage | — | Surface Mount (BGA) |