EP3CLS70F780I7 vs EP3CLS100F780I7 Comparação
Comparação detalhada lado a lado de EP3CLS70F780I7 por Intel e EP3CLS100F780I7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3CLS70F780I7 | EP3CLS100F780I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $125,00 | $775,00 |
| Family | Cyclone III LS | — |
| Logic Elements (LEs) | 70,208 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) | 4,451,328 bits (~4.4 Mbit) |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 413 | — |
| PLLs | 4 | Up to 8 (family maximum) |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 429 | — |
| Encapsulamento | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) | 780-ball FBGA (F780) |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Bitstream Encryption | AES-128/256 (LS-family feature) | — |
| Process Node | 60 nm TSMC low-power | — |
| Status RoHS | Non-compliant (per Cyclone III LS datasheet prefix per verified data) | Compliant |
| Speed Grade | 7 (moderate) | — |
| Device Family | — | Cyclone III LS |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 100,448 |
| Number of Logic Array Blocks | — | 47 (per distributor summary) |
| Number of Transceivers | — | 4 |
| Maximum User I/O | — | 413 |
| Supply Voltage (Core) | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Method | — | SRAM-based, JTAG or external flash (EPCS/EPCQ) |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Security Features | — | 256-bit AES bitstream encryption, JTAG disable |
| Tipo de montagem | — | Surface Mount (BGA) |