EP3SE110F1152I4 vs EP3SE110F1152I3 Comparaison
Comparaison détaillée côte à côte de EP3SE110F1152I4 par Intel et EP3SE110F1152I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel
EP3SE110F1152I3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SE110F1152I4 | EP3SE110F1152I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 020,00 | $4 150,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4300 | — |
| DSP Blocks | 744 | — |
| Embedded Memory (bits) | 8,936,448 | — |
| User I/Os | 744 | — |
| Boîtier | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Température de fonctionnement | -40°C to +100°C (Industrial) | -40C to +100C (Industrial, I3 grade) |
| Process Node | 40 nm | — |
| Maximum User I/O Speed | [DATA_NEEDED: maximum I/O toggle rate MHz] | — |
| PLLs | 24 | — |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) | — |
| Memory Interface Support | DDR3, DDR2, QDRII+, RLDRAM II | — |
| Transceiver Protocol Support | PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO | — |
| Statut RoHS | Compliant | Non-Compliant per DigiKey product page |
| Lead-Free | Yes | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III E |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LEs) | — | 107,500 |
| Total Memory Bits | — | 8,936,448 |
| LABs/CLBs | — | 4,300 |
| Number of I/O | — | 744 |
| Number of Logic Elements/Cells | — | 107,500 |
| Total RAM Bits | — | 8,936,448 |
| Core Operating Frequency | — | 500 MHz |
| Tension d'alimentation | — | 1.1 V |
| Process Technology | — | 65 nm CMOS (1.1 V, all-layer copper SRAM) |
| Package Type | — | 1152-BBGA, FCBGA (FC-FBGA) |