EP3SE50F780C2 vs EP3SE80F780C2 Comparaison
Comparaison détaillée côte à côte de EP3SE50F780C2 par Intel et EP3SE80F780C2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE50F780C2 | EP3SE80F780C2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 195,00 | $2 480,00 |
| Family | Stratix III E | Stratix III E |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 47,500 | — |
| LABs / CLBs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| User I/O Count | 488 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Operating Frequency | Up to 600 MHz | — |
| Boîtier | 780-BBGA, FC-FBGA | 780-Ball FC-FBGA (Flip-Chip BGA) |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: current RoHS status] | Compliant |
| Number of Pins / Terminals | 780 | — |
| Form of Terminal | Ball | — |
| Package Code | BGA | — |
| Operating Temperature Grade | Commercial (C2) | Commercial (0C to +85C) |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/Os | — | 488 |
| Logic Array Blocks (LABs) | — | 3,200 |
| DSP Blocks | — | 320 |
| Maximum Core Clock | — | 600 MHz |
| Configuration Mode | — | Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) |
| Lead-Free | — | Yes |
| Number of PLLs | — | 12 |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X |