EP3SE50F780C2 vs EP3SE80F780C2 Comparação
Comparação detalhada lado a lado de EP3SE50F780C2 por Intel e EP3SE80F780C2 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3SE50F780C2 | EP3SE80F780C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.195,00 | $2.480,00 |
| Family | Stratix III E | Stratix III E |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 47,500 | — |
| LABs / CLBs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| User I/O Count | 488 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Operating Frequency | Up to 600 MHz | — |
| Encapsulamento | 780-BBGA, FC-FBGA | 780-Ball FC-FBGA (Flip-Chip BGA) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: current RoHS status] | Compliant |
| Number of Pins / Terminals | 780 | — |
| Form of Terminal | Ball | — |
| Package Code | BGA | — |
| Operating Temperature Grade | Commercial (C2) | Commercial (0C to +85C) |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/Os | — | 488 |
| Logic Array Blocks (LABs) | — | 3,200 |
| DSP Blocks | — | 320 |
| Maximum Core Clock | — | 600 MHz |
| Configuration Mode | — | Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) |
| Lead-Free | — | Yes |
| Number of PLLs | — | 12 |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X |