EP4SGX530KH40C3 vs EP4SGX530KH40I3 Comparaison
Comparaison détaillée côte à côte de EP4SGX530KH40C3 par Intel et EP4SGX530KH40I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX530KH40C3 | EP4SGX530KH40I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8 650,00 | $12 500,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 531,200 | — |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | Up to 24 channels |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Boîtier | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Series | — | Stratix IV GX |
| Manufacturer | — | Intel (formerly Altera) |
| Process Technology | — | TSMC 40 nm |
| Logic Elements (LEs) | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Total Embedded Memory | — | 28,033,024 bits (28 Mb) |
| Number of LABs/CLBs | — | 21,248 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Maximum User I/Os | — | 744 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (I3) |