EP4SGX530KH40C3 vs EP4SGX530KH40I3 Comparação
Comparação detalhada lado a lado de EP4SGX530KH40C3 por Intel e EP4SGX530KH40I3 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4SGX530KH40C3 | EP4SGX530KH40I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $8.650,00 | $12.500,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 531,200 | — |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | Up to 24 channels |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Encapsulamento | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Status RoHS | Compliant | Compliant |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Series | — | Stratix IV GX |
| Manufacturer | — | Intel (formerly Altera) |
| Process Technology | — | TSMC 40 nm |
| Logic Elements (LEs) | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Total Embedded Memory | — | 28,033,024 bits (28 Mb) |
| Number of LABs/CLBs | — | 21,248 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Maximum User I/Os | — | 744 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (I3) |