EPF10K200EBI600-2 vs EPF10K200EBC600-1 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBI600-2 par Intel et EPF10K200EBC600-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparaison des spécifications
| Paramètre | EPF10K200EBI600-2 | EPF10K200EBC600-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $322,17 |
| Family | FLEX 10KE | — |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | 0.4 ns |
| Température de fonctionnement | 0 C to 70 C (commercial) | — |
| Boîtier | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-BGA |
| Logic Family | CMOS, SRAM-based | — |
| Type de montage | Surface Mount (BGA) | — |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | — |
| Statut RoHS | Compliant (lead-free package) | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| Tension d'alimentation | — | 2.5 V |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |