EPF10K200EBI600-2N vs EPF10K200EBC600-1 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBI600-2N par Intel et EPF10K200EBC600-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparaison des spécifications
| Paramètre | EPF10K200EBI600-2N | EPF10K200EBC600-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $140,00 | $322,17 |
| Family | FLEX 10KE | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Dedicated Inputs | 6 | — |
| Boîtier | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | 600-BGA |
| Technology / Process | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | — |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | 0.4 ns |
| Maximum Internal Frequency | 200 MHz | — |
| Température de fonctionnement | 0 °C to +70 °C (commercial) | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | — |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Type de montage | Surface Mount (BGA) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| Tension d'alimentation | — | 2.5 V |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |