EPF10K200EBI600-2N vs EPF10K200EBC600-1 Comparação
Comparação detalhada lado a lado de EPF10K200EBI600-2N por Intel e EPF10K200EBC600-1 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparação de especificações
| Parâmetro | EPF10K200EBI600-2N | EPF10K200EBC600-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $140,00 | $322,17 |
| Family | FLEX 10KE | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Dedicated Inputs | 6 | — |
| Encapsulamento | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | 600-BGA |
| Technology / Process | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | — |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | 0.4 ns |
| Maximum Internal Frequency | 200 MHz | — |
| Temperatura de operação | 0 °C to +70 °C (commercial) | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | — |
| Nível MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Tipo de montagem | Surface Mount (BGA) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| Tensão de alimentação | — | 2.5 V |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |