EPF10K200SBC356-3 vs EPF10K200SBI356-2 Comparaison
Comparaison détaillée côte à côte de EPF10K200SBC356-3 par Intel et EPF10K200SBI356-2 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K200SBC356-3 | EPF10K200SBI356-2 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $87,50 | $92,50 |
| Family | FLEX 10K | FLEX 10KS |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 24 (98,304 bits RAM) |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | — |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| Température de fonctionnement | 0 C to 70 C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Boîtier | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-BGA (SB) 35×35 mm, 1.27 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 9,984 |
| System Gates | — | 200,000 |
| User I/O Pins | — | 274 |
| Core Voltage | — | 2.5 V |
| Speed Grade | — | -2 |
| Maximum User I/O | — | 274 |
| In-System Programmability | — | Yes (JTAG/ByteBlaster) |
| Configuration Method | — | SRAM-based, ISP |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |