EPF10K200SBC600-2 vs EPF10K250EBI600-3 Comparaison
Comparaison détaillée côte à côte de EPF10K200SBC600-2 par Altera et EPF10K250EBI600-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EPF10K200SBC600-2 | EPF10K250EBI600-3 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $85,00 | $110,00 |
| Manufacturer | Altera (now Intel) | — |
| Series | FLEX-10KS | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Typical Gates | 200,000 | — |
| User I/Os | 470 | — |
| Propagation Delay | 0.4 ns | — |
| Voltage - Supply (VCCINT) | 2.375 V to 2.625 V | — |
| Température de fonctionnement | 0 C to 70 C | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Type de montage | Surface Mount | Surface Mount |
| Boîtier / Format | 600-BGA (45 x 45 mm, 1.27 mm pitch) | — |
| Supplier Device Package | 600-BGA | — |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.22 micrometer | 0.22 µm CMOS, 4-layer metal |
| Embedded Array Blocks (EABs) | Yes (for distributed RAM/ROM) | — |
| PLLs | 4 | 4 |
| Configuration Interface | IEEE 1149.1 JTAG | — |
| MultiVolt I/O | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) | — |
| Packaging | Bulk / Tray | — |
| Statut RoHS | Non-compliant | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Family | — | FLEX 10KE |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Boîtier | — | 600-ball BGA (HBGA) |
| Ball Pitch | — | 1.93 mm |
| Core Voltage | — | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Speed Grade | — | -3 (fastest) |
| Configuration Method | — | SRAM, requires external configuration device (EPC series) |
| Lead-free | — | no (legacy tin-lead per distributor description) |