EPF10K200SBC600-2 vs EPF10K250EBI600-3 Comparison
Detailed side-by-side comparison of EPF10K200SBC600-2 by Altera and EPF10K250EBI600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF10K200SBC600-2 | EPF10K250EBI600-3 |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last Time Buy |
| Manufacturer | Altera (now Intel) | — |
| Series | FLEX-10KS | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Typical Gates | 200,000 | — |
| User I/Os | 470 | — |
| Propagation Delay | 0.4 ns | — |
| Voltage - Supply (VCCINT) | 2.375 V to 2.625 V | — |
| Operating Temperature | 0 C to 70 C | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 600-BGA (45 x 45 mm, 1.27 mm pitch) | — |
| Supplier Device Package | 600-BGA | — |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.22 micrometer | 0.22 µm CMOS, 4-layer metal |
| Embedded Array Blocks (EABs) | Yes (for distributed RAM/ROM) | — |
| PLLs | 4 | 4 |
| Configuration Interface | IEEE 1149.1 JTAG | — |
| MultiVolt I/O | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) | — |
| Packaging | Bulk / Tray | — |
| RoHS Status | Non-compliant | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Family | — | FLEX 10KE |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Package | — | 600-ball BGA (HBGA) |
| Ball Pitch | — | 1.93 mm |
| Core Voltage | — | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Speed Grade | — | -3 (fastest) |
| Configuration Method | — | SRAM, requires external configuration device (EPC series) |
| Lead-free | — | no (legacy tin-lead per distributor description) |