EPF10K200SRC240-1X vs EPF10K200SRC240-3N Comparaison
Comparaison détaillée côte à côte de EPF10K200SRC240-1X par Intel et EPF10K200SRC240-3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K200SRC240-1X | EPF10K200SRC240-3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $540,00 | $162,00 |
| Series | FLEX-10KS | — |
| Family | FLEX 10KS | FLEX 10KE |
| Logic Elements / Cells | 9984 | — |
| Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded SRAM (EABs) | 98,304 bits | — |
| Maximum User I/O | 182 | — |
| I/O Banks | 4 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (multi-voltage I/O) | — |
| Speed Grade | -1 (fastest commercial) | -3 (commercial) |
| Température de fonctionnement | -40C to +85C (industrial) | 0 °C to +70 °C (Commercial) |
| Process Technology | 0.22 um / 0.3 um CMOS | 0.22 µm CMOS SRAM |
| Boîtier | 240-RQFP (32x32 mm, 0.5 mm pitch) | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Non-Compliant (legacy FLEX 10KS) | [DATA_NEEDED: RoHS status] |
| Configuration Mode | Serial / Parallel EPROM or JTAG | — |
| Typical System Gates | — | 200,000 |
| Logic Elements (LEs) | — | 9,984 |
| Maximum Logic Elements | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 24 |
| Maximum User RAM Bits | — | 98,304 |
| User I/Os | — | 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions |
| Propagation Delay (tPD) | — | 0.40 ns |
| Internal Operating Frequency | — | 166.67 MHz |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V and 3.3 V interfaces |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic) |
| Configuration Method | — | SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading |