EPF10K200SRC240-1X vs EPF10K200SRC240-3N Comparação
Comparação detalhada lado a lado de EPF10K200SRC240-1X por Intel e EPF10K200SRC240-3N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EPF10K200SRC240-1X | EPF10K200SRC240-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $540,00 | $162,00 |
| Series | FLEX-10KS | — |
| Family | FLEX 10KS | FLEX 10KE |
| Logic Elements / Cells | 9984 | — |
| Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded SRAM (EABs) | 98,304 bits | — |
| Maximum User I/O | 182 | — |
| I/O Banks | 4 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (multi-voltage I/O) | — |
| Speed Grade | -1 (fastest commercial) | -3 (commercial) |
| Temperatura de operação | -40C to +85C (industrial) | 0 °C to +70 °C (Commercial) |
| Process Technology | 0.22 um / 0.3 um CMOS | 0.22 µm CMOS SRAM |
| Encapsulamento | 240-RQFP (32x32 mm, 0.5 mm pitch) | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | Non-Compliant (legacy FLEX 10KS) | [DATA_NEEDED: RoHS status] |
| Configuration Mode | Serial / Parallel EPROM or JTAG | — |
| Typical System Gates | — | 200,000 |
| Logic Elements (LEs) | — | 9,984 |
| Maximum Logic Elements | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 24 |
| Maximum User RAM Bits | — | 98,304 |
| User I/Os | — | 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions |
| Propagation Delay (tPD) | — | 0.40 ns |
| Internal Operating Frequency | — | 166.67 MHz |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V and 3.3 V interfaces |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic) |
| Configuration Method | — | SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading |