EPF10K250EFC672-1 vs EPF10K250EFC672-2 Comparaison
Comparaison détaillée côte à côte de EPF10K250EFC672-1 par Intel et EPF10K250EFC672-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K250EFC672-1 | EPF10K250EFC672-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $115,00 | $108,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | CMOS, SRAM-based |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Température de fonctionnement | 0C to +70C (Commercial) | 0 C to +70 C (Commercial) |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Programming Technology | In-system, SRAM-based | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-RoHS Compliant (per Fly-Wing listing) |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | — |
| Logic Elements | — | 12,480 |
| Typical Gates | — | 250,000 |
| Embedded Array Blocks (EABs) | — | 20 |
| Maximum User RAM Bits | — | 40,960 |
| User I/Os | — | 470 |
| Boîtier | — | 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| Nombre de broches | — | 672 |
| Core Supply Voltage | — | 2.3 V (typical 2.5 V) |
| I/O Standard Support | — | 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) |
| Configuration | — | SRAM, in-system programmable (ISP) via JTAG |
| Boundary Scan | — | IEEE 1149.1 (JTAG) compliant |