M1AFS1500-1FGG256 vs M1AFS1500-1FG256K Comparaison
Comparaison détaillée côte à côte de M1AFS1500-1FGG256 par Microchip Technology et M1AFS1500-1FG256K par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActifMicrochip Technology
M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
M1AFS1500-1FG256K ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-1FGG256 | M1AFS1500-1FG256K |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $172,23 | $627,13 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | 1500000 |
| Logic Cells | 38,400 | 38400 |
| Embedded Processor | ARM Cortex-M1 | — |
| Fréquence d'horloge maximale | 350 MHz | — |
| Number of I/Os | 119 | — |
| Tension d'alimentation | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Boîtier / Format | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Style de montage | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | -1 |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | RoHS Non-Compliant |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Manufacturer | — | Microchip Technology |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| Number of I/O | — | 119 |
| Flash Memory | — | 276480 bits |
| Processor Core | — | ARM Cortex-M1 (soft core) |
| Boîtier | — | 256-LBGA (FG256) |
| Type de montage | — | Surface Mount |
| Configuration Technology | — | Flash (instant-on, single-chip) |
| Analog Features | — | Configurable analog blocks (Fusion mixed-signal) |
| Programmability | — | In-System Programmable |
| Lead Free Status | — | Contains Lead |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| Embedded Memory Blocks | — | [DATA_NEEDED: SRAM block size] |
| Niveau MSL | — | [DATA_NEEDED: moisture sensitivity level] |