M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
Référence : M1AFS1500-1FGG256 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $215.29 | $215,29 |
| 10 | $204.53 | $2 045,30 |
| 25 | $193.76 | $4 844,00 |
| 100 | $182.99 | $18 299,00 |
| 1 000 | $172.23 | $172 230,00 |
M1AFS1500-1FGG256 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that designers configure after manufacturing. The Fusion family extends this concept into the mixed-signal domain, sitting within the broader hierarchy of programmable logic devices -> FPGAs -> mixed-signal FPGAs -> system-on-chip programmable platforms. Fusion devices integrate configurable analog circuitry, large flash memory blocks, and comprehensive clock generation and management circuitry alongside flash-based programmable logic in a single monolithic die, eliminating external analog front-end and configuration devices.
Key differentiating features include the M1 prefix denoting an embedded ARM Cortex-M1 processor integrated with the Fusion fabric, flash-based (non-volatile) configuration that removes the need for external boot PROMs, integrated configurable analog blocks for voltage and temperature monitoring, and 130 nm CMOS flash technology with security benefits over SRAM FPGAs.
The architecture combines ProASIC3-style flash-based fabric with analog conditioning circuitry: analog inputs are filtered, amplified, and converted on-chip, while the digital fabric provides 38,400 logic cells for state machines, datapath, and the Cortex-M1 soft/hard core integration. The -1 speed grade and commercial 0 C to +70 C operating range target cost-optimized embedded control systems.
Typical applications include industrial control and monitoring, embedded processing platforms using the ARM Cortex-M1, power-supply supervision with integrated analog sensing, and motor control systems requiring mixed-signal integration.
Design consideration: plan I/O banking and 1.5 V core power sequencing early; flash FPGAs retain configuration through power cycles but must respect live-update and analog input ranges per the manufacturer datasheet.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour M1AFS1500-1FGG256 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M1AFS1500-1FGG256 (même facteur de forme et même empreinte) — différant par Family, System Gates, Package, RoHS Status, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M1AFS1500-2FGG256
✅ Remplacement direct✓ En stock
$124.5 / unité
Voir la fiche technique →M1AFS1500-FGG256I
✅ Remplacement direct✓ En stock
$289.9 / unité
Voir la fiche technique →M1AFS1500-FGG256K
✅ Remplacement direct✓ En stock
$60.2 / unité
Voir la fiche technique →M1AFS1500-1FGG256Y
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M1AFS1500-1FGG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M1AFS1500-1FGG256 Valeurs maximales et caractéristiques électriques
| Series | Fusion (M1AFS1500) |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Embedded Processor | ARM Cortex-M1 |
| Fréquence d'horloge maximale | 350 MHz |
| Number of I/Os | 119 |
| Tension d'alimentation | 1.5 V |
| Technology | CMOS, 130 nm |
| Configuration Memory | Flash-based (non-volatile) |
| Boîtier / Format | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | 1.00 mm |
| Style de montage | SMD/SMT |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +70 C |
| Packaging | Tray |
| Speed Grade | -1 |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | Yes |
| Clock Management | Integrated clock generation and management circuitry |
Guide de configuration des broches du M1AFS1500-1FGG256 256-lbga (fbga, s-pbga-b256)
Configuration des broches du M1AFS1500-1FGG256 (boîtier 256-lbga (fbga, s-pbga-b256)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M1AFS1500-1FGG256.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M1AFS1500-1FGG256 convient pour 6 applications: Embedded Processing with ARM Cortex-M1, Industrial Control and Monitoring, Power Supply Supervision and Sequencing, Motor Control Systems, Secure Configuration and Anti-Tamper Designs, Networking and Communication Interface Cards.
Embedded Processing with ARM Cortex-M1
The M1AFS1500-1FGG256 embeds an ARM Cortex-M1 processor within the 1.5M-gate Fusion fabric, letting engineers implement a complete microcontroller-class processing system plus custom hardware accelerators in a single 256-ball FBGA. With 38,400 logic cells available around the processor, peripherals such as custom UARTs, SPI engines, and DMA controllers are implemented directly in fabric, while flash-based configuration removes the external boot device required by SRAM FPGAs. The 350 MHz fabric capability comfortably handles typical Cortex-M1 clock domains in the tens of megahertz, and the 1.5 V core keeps power density manageable in space-constrained embedded controllers. This integration shortens BOM count versus a discrete MCU plus CPLD approach.
Recommandé
Industrial Control and Monitoring
Fusion FPGAs were architected specifically for industrial monitoring: integrated configurable analog conditioning and conversion blocks measure board-level voltages and temperatures without external ADCs, while the 119 user I/Os and 38,400 logic cells implement sensor polling, filtering, and control state machines in the same die. The flash-based fabric survives power interruptions and reconfigures instantly at power-up, valuable in unattended factory equipment. For the commercial 0 C to +70 C rated -1FGG256, deploy in environmentally controlled industrial cabinets; for harsher settings, the drop-in industrial-range M1AFS1500-FGG256I substitutes without PCB change. Integrated clock management circuitry simplifies timing across multiple motor and sensor interfaces.
Recommandé
Power Supply Supervision and Sequencing
The Fusion family's mixed-signal front end makes the M1AFS1500-1FGG256 effective as a power-supply supervisor: analog conditioning blocks monitor rail voltages and die temperature, and fabric logic executes sequencing, brown-out detection, and fault latching. Its own 1.5 V core and flash configuration start autonomously, so supervision is active immediately at power-up - a property discrete SRAM FPGA supervisors cannot match. Designers should budget the analog input ranges per the manufacturer datasheet and confirm measurement accuracy against system tolerances. In multi-rail boards the fabric can sequence upstream DC-DC enables while logging faults through the embedded ARM Cortex-M1 to host via UART or SPI.
Recommandé
Motor Control Systems
Motor controllers benefit from the M1AFS1500-1FGG256's combination of deterministic fabric logic for PWM generation and the ARM Cortex-M1 for supervisory control. The 38,400 logic cells implement multi-channel PWM, dead-time insertion, quadrature decoding, and current-loop comparators with microsecond-scale latency, while on-chip analog conditioning monitors bus voltage and temperature for protection. At a 350 MHz maximum fabric capability, high-resolution PWM carriers remain well within timing budget. Because 119 I/Os are available, gate-driver interfaces, encoder inputs, and communication links connect without external glue logic. Commercial temperature rating suits appliance and light-industrial drives; use the FGG256I variant for demanding thermal environments.
Recommandé
Secure Configuration and Anti-Tamper Designs
Flash-based Fusion FPGAs store configuration in non-volatile on-chip flash rather than an external bitstream file, substantially reducing the bitstream-interception risk inherent to SRAM FPGAs. For equipment requiring design confidentiality - industrial instruments, licensed hardware, and access-control systems - the M1AFS1500-1FGG256 keeps the programming image internal, and the Fusion family datasheet documents additional security features of the flash fabric. The 1.5M-gate capacity accommodates encryption blocks alongside application logic, and the ARM Cortex-M1 can run key-management routines. Designers should still review the manufacturer's security documentation, as flash FPGA security is strong but not equivalent to a dedicated secure element.
Recommandé
Networking and Communication Interface Cards
With 119 user I/Os, integrated clock management circuitry, and 350 MHz fabric capability, the M1AFS1500-1FGG256 bridges legacy and modern communication interfaces on line cards and control modules: fabric logic implements UART, SPI, I2C, parallel buses, and simple protocol engines, while the ARM Cortex-M1 runs the protocol stack. Flash-based configuration means the card is functional immediately on slot insertion with no configuration download delay. The 1.00 mm pitch 256-ball FBGA reflows on standard SMT lines. For designs targeting wider temperature or demanding timing, verify speed grade selection (-1 vs -2) during timing closure in Libero before committing the PCB.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M1AFS1500-1FGG256 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M1AFS1500-2FGG256 | M1AFS1500-FGG256I | M1AFS1500-FGG256 |
|---|---|---|---|---|
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/Os | 119 | 119 | 119 | 119 |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
Principaux différenciateurs
- Flash-based non-volatile configuration eliminates external boot device (vs SRAM FPGAs (generic))
- Integrated mixed-signal analog conditioning on-chip (vs M1AFS1500-2FGG256)
- Embedded ARM Cortex-M1 processor in fabric (vs AFS1500 (non-M1 Fusion))
- Temperature grade flexibility on identical footprint (vs M1AFS1500-FGG256I)
Notes de conception
The M1AFS1500-1FGG256 operates from a 1.5 V core supply; provide dedicated low-noise core rails and follow Microchip's Fusion power-up guidance because the flash fabric and analog conditioning blocks have defined supply sequencing relationships. Size the 1.5 V regulator for the full 1.5M-gate fabric switching activity - a rule-of-thumb starting point is to budget estimated core current from Microchip's power calculator in Libero rather than datasheet typicals, then add 30-50% margin. Decouple each VCC domain with bulk plus 0.1 uF ceramics at ball side vias.
The 256-ball FBGA with 1.00 mm pitch supports conventional via-in-pad or dog-bone breakout on 0.8-1.0 mm pitch fanout rules; a 4-layer minimum stack (signal-GND-power-signal) is recommended so the 119 I/Os escape without splitting planes. Place 0.1 uF ceramics within 2 mm of power balls. Analog conditioning inputs should route away from switching clock nets to preserve the Fusion analog block accuracy. Keep the JTAG programming chain accessible on test points for in-system programming of the flash fabric.
Do not treat the commercial 0 C to +70 C rating as suitable for unheated outdoor or high-ambient industrial enclosures - specify M1AFS1500-FGG256I instead before layout freeze. Also verify the speed grade (-1 vs -2) during Libero timing closure: designs that pass on a -2 device may fail static timing on the -1 part, and late speed-grade changes affect both cost and long-term sourcing. Finally, confirm lifecycle status with Microchip, as the Fusion family is mature and new designs should evaluate SmartFusion2/PolarFire migration paths.
Informations de conformité
Compliance data not explicitly stated in provided distributor snippets; verify against Microchip's official product compliance documentation for M1AFS1500-1FGG256.
