M1AFS250-2FGG256I vs M1AFS250-1FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-2FGG256I par Microchip Technology et M1AFS250-1FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ ActifMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-2FGG256I | M1AFS250-1FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $83,12 | $0,00 |
| Family | Actel Fusion (Mixed-Signal FPGA) | — |
| System Gates | 250000 gates | 250,000 gates |
| Registers (DFFs) | 36864 | — |
| User I/Os | 114 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm, 7-layer metal CMOS | — |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -2 | — |
| Core Supply Voltage | 1.5 V | — |
| Boîtier | 256-ball FBGA (FGG256) | — |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | -40C to +85C (industrial, I grade) | — |
| Security | 128-bit Flash lock, AES decryption | 128-bit flash-based lock, AES decryption |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Statut RoHS | Compliant (FGG = Pb-free balls) | [DATA_NEEDED: RoHS status] |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| Tension d'alimentation de fonctionnement | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Boîtier / Format | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style de montage | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |