M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
Référence : M1AFS250-2FGG256I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $103.9 | $103,90 |
| 10 | $98.71 | $987,10 |
| 100 | $93.51 | $9 351,00 |
| 500 | $88.31 | $44 155,00 |
| 1 000 | $83.12 | $83 120,00 |
M1AFS250-2FGG256I Présentation
A Fusion FPGA is a type of field-programmable gate array that integrates programmable logic, flash configuration memory, and analog mixed-signal peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable logic device -> programmable semiconductor), the Fusion family is distinctive because it adds analog-to-digital conversion, voltage/temperature monitoring, and power-management functionality alongside the fabric and the ARM Cortex-M1 soft-to-hard MCU integration, enabling true single-chip system solutions.
Key features include nonvolatile Flash configuration that retains the program when powered off, Live-at-Power-Up (LAPU) operation so the device is functional as soon as system power is applied within normal operating specifications, and integrated security: a 128-bit flash-based lock and industry-leading AES decryption to protect programmed IP and configuration data. The -2 speed grade and industrial (I) temperature grade make the device suited to harsh-environment embedded control.
Technical depth: because configuration storage is Flash rather than SRAM, no external configuration PROM is required, reducing board area and BOM cost while improving configuration-data security. The embedded ARM Cortex-M1 processor allows firmware plus programmable logic in one chip, and the analog subsystem (ADC, monitoring blocks) eliminates external supervisory components in many designs.
Typical applications include industrial automation and motor-control interfaces, power-supply and system monitoring, portable and low-power instrumentation, and embedded controllers that combine an MCU with glue logic and analog sensing.
Design consideration: verify I/O bank voltage assignments and analog pin usage early in the FGG256 footprint layout, since mixed-signal pin multiplexing constrains placement more than a pure-digital FPGA.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour M1AFS250-2FGG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M1AFS250-2FGG256I (même facteur de forme et même empreinte) — différant par Package, Family, RoHS Status, System Gates, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M1AFS250-2FG256
✅ Remplacement direct✓ En stock
$28.75 / unité
Voir la fiche technique →M1AFS250-1FGG256
✅ Remplacement direct✓ En stock
$30.6 / unité
Voir la fiche technique →M1AFS600-FG256
✅ Remplacement direct✓ En stock
$22 / unité
Voir la fiche technique →M1AFS600-1FG256
✅ Remplacement direct✓ En stock
$69.15 / unité
Voir la fiche technique →M1AFS250-2FGG256I Valeurs maximales et caractéristiques électriques
| Family | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250000 gates |
| Registers (DFFs) | 36864 |
| User I/Os | 114 |
| Embedded Processor | ARM Cortex-M1 |
| Configuration Technology | Flash-based, nonvolatile |
| Process Technology | 130 nm, 7-layer metal CMOS |
| System Performance | Up to 350 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Boîtier | 256-ball FBGA (FGG256) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (industrial, I grade) |
| Security | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | Live at Power-Up (LAPU) |
| Statut RoHS | Compliant (FGG = Pb-free balls) |
Guide de configuration des broches du M1AFS250-2FGG256I 256-ball fbga (fgg256)
Configuration des broches du M1AFS250-2FGG256I (boîtier 256-ball fbga (fgg256)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M1AFS250-2FGG256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M1AFS250-2FGG256I convient pour 6 applications: Industrial Automation and Control, Power Supply and System Monitoring, Secure Embedded Controllers, Portable and Low-Power Instrumentation, Motor Drive and Motion Control, Test and Measurement Equipment.
Industrial Automation and Control
The M1AFS250-2FGG256I fits factory automation nodes that combine programmable sequencing, analog monitoring, and firmware control in one device. Its 250K gates with 114 user I/Os handle sensor aggregation, PWM generation, and field-bus glue logic, while the embedded ARM Cortex-M1 runs the deterministic control loop at firmware speed. The industrial -40C to +85C rating guarantees timing over harsh cabinet temperatures, and Flash nonvolatility means the machine boots into a known state instantly at power-up without an external configuration PROM. Using the on-chip analog subsystem for voltage and temperature supervision eliminates discrete monitoring ICs, cutting BOM count and board area in dense I/O modules.
Recommandé
Power Supply and System Monitoring
Because Fusion devices are Live-at-Power-Up (LAPU), the M1AFS250-2FGG256I is functional as soon as system power is applied within normal operating specifications - exactly the behavior required for power-supply supervision, brown-out detection, and sequencing control. The mixed-signal fabric digitizes rail voltages and die temperature through the on-chip ADC, while programmable logic implements comparator thresholds, fault latching, and PMBus-style sequencing state machines. The ARM Cortex-M1 can host higher-level telemetry firmware on the same die. Designers benefit from a 1.5 V core supply and Flash retention that keeps trip-point settings through power cycles without external NVM.
Recommandé
Secure Embedded Controllers
The M1AFS250-2FGG256I provides a 128-bit Flash-based lock and industry-leading AES decryption to protect programmed IP and configuration data, per the manufacturer datasheet. Combined with nonvolatile on-chip configuration, this removes the external bitstream attack surface that SRAM FPGAs expose, making the device a strong fit for secure embedded controllers in industrial equipment, access systems, and licensed-feature hardware. The ARM Cortex-M1 core runs application firmware alongside hardware security logic, so encryption engines, key handling, and tamper-response state machines execute in fabric while protocol stacks run on the processor - all isolated on a single 130-nm die.
Recommandé
Portable and Low-Power Instrumentation
Handheld and battery-powered instruments benefit from the single-chip approach of the M1AFS250-2FGG256I: Flash FPGAs consume no configuration boot power and eliminate the external PROM, reducing quiescent board draw and standby current. The 1.5 V core supply suits modern low-voltage rails, and integrating the analog monitoring subsystem means fewer active components between measurements. With 250K gates, the fabric implements acquisition timing, DSP pre-processing, and display interface logic, while the Cortex-M1 manages UI and communication firmware. The FGG256 1.0 mm-pitch ball grid array keeps routing compact in tightly packaged portable enclosures.
Recommandé
Motor Drive and Motion Control
Motion-control subsystems use the M1AFS250-2FGG256I to merge position-feedback decoding (quadrature, resolver-style interfaces in fabric), PWM generation, and safety interlocks in programmable logic while the ARM Cortex-M1 executes the speed/current loops in firmware. The 114 user I/Os provide headroom for encoder inputs, gate-driver PWM outputs, and fault feedback lines. Industrial temperature qualification ensures behavior is guaranteed in drive enclosures, and LAPU operation allows the drive to enter a defined safe state immediately at power application. The 350 MHz-class fabric timing (-2 grade) supports fine-grained PWM resolution at switching frequencies used in servo drives.
Recommandé
Test and Measurement Equipment
Bench and rack instruments use the M1AFS250-2FGG256I as a flexible timing, trigger, and interface controller. Flash configuration allows the instrument to be measurement-ready the instant power is applied, shortening perceived startup time, and the fabric implements time-critical trigger state machines, counter/timer channels, and bus bridges (UART/SPI/I2C to USB or Ethernet glue logic). The 36864 registers provide ample sequential depth for pattern generators, and 114 I/Os connect front-end circuitry directly. On-chip voltage/temperature monitoring supports self-test routines executed by the ARM Cortex-M1 at boot and during calibration cycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M1AFS250-2FGG256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M1AFS250-2FG256 | M1AFS250-1FGG256 | M1AFS600-FG256 | M1AFS600-1FG256 |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (FGG256) | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 600K | 600K |
| Speed Grade | -2 | -2 | -1 (slower) | standard | -1 |
| Temperature Grade | Industrial (I, -40C to +85C) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Embedded Processor | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) |
| Configuration Technology | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principaux différenciateurs
- Nonvolatile Flash configuration with Live-at-Power-Up (vs M1AFS600-FG256)
- Faster timing in the same footprint (vs M1AFS250-1FGG256)
- Integrated ARM Cortex-M1 plus mixed-signal analog in one chip (vs M1AFS250-2FG256)
Notes de conception
The M1AFS250-2FGG256I uses a 1.5 V core supply on a 130-nm process. Estimated: budget the core rail for worst-case switching activity (recommended to size the core regulator with at least 50% margin over typical current, computed in Microchip Libero power tools for your actual design). I/O bank rails are set independently per bank, so plan the board's rail map before pin assignment to avoid bank-voltage conflicts that force a PCB respin.
The 256-ball FGG256 BGA requires controlled-impedance multilayer routing; use via-in-pad or dogbone fanout on a 1.0 mm pitch and reserve at least two inner layers as a solid ground/power plane pair under the device. Keep analog monitoring inputs routed away from switching I/O to preserve ADC accuracy, and follow the datasheet decoupling network (bulk plus high-frequency ceramics at each supply pin group). Confirm ball finish (Pb-free 'GG') in your assembly profile.
Do not substitute speed or temperature grades without re-running static timing: M1AFS250-1FGG256 is drop-in pin-compatible but slower (-1), and M1AFS600 variants change fabric capacity though not the footprint. Also, Flash FPGAs configure instantly (LAPU), so do not rely on configuration delay for power-rail settling; implement explicit reset/monitoring logic in fabric. Finally, lock Flash IP with the 128-bit lock and AES features before production programming.
Informations de conformité
The FGG (GG) suffix denotes Pb-free balls and RoHS-compliant construction per Microsemi/Microchip ordering nomenclature. REACH, halogen-free, and conflict-minerals status should be confirmed via the Microchip product compliance portal.
