M1AFS250-FGG256 vs M1AFS250-1FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-FGG256 par Microchip Technology et M1AFS250-1FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS250-FGG256 ✓ ActifMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-FGG256 | M1AFS250-1FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $88,00 | $0,00 |
| Family | Fusion (M1 series, mixed-signal FPGA) | — |
| System Gates | 250,000 | 250,000 gates |
| Logic Cells | 6144 | 6144 |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 (M1 variants) | — |
| Fréquence d'horloge maximale | 350 MHz | — |
| Configuration Memory | Flash-based, live at power-up | Nonvolatile flash (Live at Power-Up, LAPU) |
| Flash Memory Bits | 36864 | — |
| Technology | CMOS | 130-nm, 7-layer metal, flash-based CMOS |
| Boîtier | 256-LBGA (FGG256), 1.0 mm ball pitch | — |
| Type de montage | Surface Mount | — |
| Statut RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Lead Free | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Tension d'alimentation | [DATA_NEEDED: core supply voltage] | — |
| Analog Peripherals | Configurable analog (voltage/temperature monitoring) | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Series | — | M1AFS250 (Fusion) |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Security | — | 128-bit flash-based lock, AES decryption |
| Tension d'alimentation de fonctionnement | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Boîtier / Format | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style de montage | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |