M1AFS250-FGG256 vs M1AFS250-1FGG256I Comparison

Detailed side-by-side comparison of M1AFS250-FGG256 by Microchip Technology and M1AFS250-1FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS250-FGG256 M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS250-FGG256 ✓ Active
Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Active

Specification Comparison

Parameter M1AFS250-FGG256 M1AFS250-1FGG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $88.00 $0.00
Family Fusion (M1 series, mixed-signal FPGA) —
System Gates 250,000 250,000 gates
Logic Cells 6144 6144
User I/O 114 —
Embedded Processor ARM Cortex-M1 (M1 variants) —
Maximum Clock Frequency 350 MHz —
Configuration Memory Flash-based, live at power-up Nonvolatile flash (Live at Power-Up, LAPU)
Flash Memory Bits 36864 —
Technology CMOS 130-nm, 7-layer metal, flash-based CMOS
Package 256-LBGA (FGG256), 1.0 mm ball pitch —
Mounting Type Surface Mount —
RoHS Status RoHS Compliant [DATA_NEEDED: RoHS status]
Lead Free Status Lead Free —
Operating Temperature [DATA_NEEDED: operating temperature range] —
Supply Voltage [DATA_NEEDED: core supply voltage] —
Analog Peripherals Configurable analog (voltage/temperature monitoring) —
Clock Management On-chip clock generation and management circuitry —
Series — M1AFS250 (Fusion)
Total SRAM/Flip-Flop Bits (DigiKey listing) — 36864
Number of I/O — 114
Maximum System Frequency — 350 MHz
Processor Core — ARM Cortex-M1 (optional ARM support, M1 variant)
Security — 128-bit flash-based lock, AES decryption
Operating Supply Voltage — 1.5 V
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Package / Case — 256-LBGA (FBGA), 1.00 mm ball pitch
Mounting Style — SMD/SMT
Packaging — Tray
Mixed-Signal Features — Configurable analog, flash memory blocks, clock generation and management
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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