M1AFS600-1FGG484K vs AFS600-FG484 Comparaison

Comparaison détaillée côte à côte de M1AFS600-1FGG484K par Microchip Technology et AFS600-FG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Microchip Technology
M1AFS600-1FGG484K M1AFS600-1FGG484K - Fusion FPGA 600K Gates 484-BGA | Microchip

M1AFS600-1FGG484K - Fusion FPGA 600K Gates 484-BGA | Microchip

M1AFS600-1FGG484K ✓ Actif
Microchip Technology
AFS600-FG484 AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip

AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip

AFS600-FG484 ✓ Actif

Comparaison des spécifications

Paramètre M1AFS600-1FGG484K AFS600-FG484
Marque Microchip Technology Microchip Technology
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $155,00 $90,57
Family Fusion (M1 series) —
System Gates 600K —
Logic Elements [DATA_NEEDED: logic element count] —
Total Flash Configuration Bits 110592 —
User I/O 172 172 I/O
Embedded Processor ARM Cortex-M1 (M1 variant) —
Technology 130 nm flash-based CMOS Advanced 130 nm, 7-layer metal, flash-based CMOS
Core Voltage 1.5 V —
Boîtier 484-pin FBGA (FGG484) 484-ball PBGA
Type de montage Surface Mount —
Max Frequency 1282.05 MHz (family reference) —
Configuration Memory On-chip flash (single-chip, instant-on) Embedded nonvolatile flash
Analog Peripherals Configurable analog blocks (Fusion architecture) —
Clock Management Integrated clock generation and management circuitry —
Speed Grade -1 —
Température de fonctionnement [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Packaging Option Tray (K suffix) —
Statut RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Device Type — Fusion mixed-signal FPGA
Equivalent Gate Count — 600,000 gates
Logic Cells — 13,824 logic cells in related 600K-package variants
Package Dimensions — 23.00 mm x 23.00 mm in related 600K-package variants
Package Ball Pitch — 1.00 mm
Power-Up Configuration — Live at power-up in applicable Fusion devices
Programmable Resources — Configurable analog, programmable logic, embedded flash, and clock management
Processor Support — Optional ARM support in the Fusion family
Product Family — Fusion mixed-signal FPGAs
Manufacturer — Microchip Technology
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Halogen-Free Status — [DATA_NEEDED: halogen-free status]
Tension d'alimentation — [DATA_NEEDED: supply voltage range]

Fiches techniques et ressources

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